OSN9800 TNV1E212 10G Enhanced Aggregation Board High-density Access Intelligent Business Scheduling

Yantai Boxin International Trading Co., Ltd. is a professional comprehensive trading service provider for communication equipment.With warehouses established in Yantai and Hong Kong, we have built a complete and localized network for delivering communication products and services.In 2018, Yantai Boxin International Trading Co., Ltd. set up its international sales department in Yantai, China.Based in China, we operate in emerging markets across Southeast Asia, India, the Middle East, Africa, Europe, and the United States. 

Yantai Boxin International Trading Co., Ltd. supplies products to various telecom operators, meeting their needs for supplementing and expanding 2G/3G/4G/5G network stations.Our current equipment portfolio covers brands such as Nokia, Ericsson, Alcatel, Huawei, ZTE, ZTT, and FiberHome. 

We expand our international market share by offering high-quality products, excellent service, competitive pricing, and timely delivery.Feel free to contact us for more information.

Description du produit

1.Product Overview

TNV1E212 is a high-density enhanced intelligent compact multi service 10G wavelength division multiplexing circuit board on the OSN 9800 series optical transmission platform.On the basis of compact design, this board is specifically designed to cope with business intensive scenarios such as urban edge, core access to large enterprise parks, and shared data centers among multiple operators by increasing the density of customer side ports and the ability to switch scheduling within the board.It aims to achieve unified aggregation, flexible scheduling, and efficient transmission of massive low - and medium speed businesses through a single board high integration solution, and is a key component for building high-density, high-value edge intelligent nodes.

2.Core features and high-density positioning

High density multi service port integration

Within the standard compact card size, it integrates significantly more customer side business interfaces than conventional cards, typically supporting up to 8 or more SFP/SFP+interfaces.

Support flexible port configuration for different speeds (such as 10GE, GE, STM-16/4, etc.)to meet the high-density access requirements of a large number of dispersed business points and maximize single slot access capability.

Powerful onboard business aggregation and exchange matrix

Equipped with high-performance switching processing units, it has powerful layer 2 Ethernet switching and OTN layer crossing capabilities.

Support efficient aggregation of dozens of connected business flows, policy based switching (VLAN, QoS), and flexible scheduling of sub wavelength levels (ODU0/1/2 crossover), achieving an upgrade from"simple access" to"intelligent switching aggregation".

Optimization Design for High Density Environment

Adopting advanced heat dissipation and power management technologies to ensure stability and reliability when operating at full load on high-density ports.

Optimize signal layout and power design to ensure signal integrity during multi-channel parallel transmission.

Simplify high-density node operation and maintenance

Through unified intelligent network management, batch configuration, unified monitoring, and visualization of all ports, business flows, and cross connections on the board can be achieved, greatly simplifying the operational complexity of high-density nodes.

Support port grouping management, configuration templates, and one click fault location to improve operation and maintenance efficiency.

3.Detailed technical specifications

1.Physical and General Specifications

Model: TNV1E212

Applicable platform: OSN 9800 series subrack

Board type: High density enhanced intelligent compact multi service 10G line processing board

Customer side port density: high-density configuration (such as 8 ports or more).

Typical power consumption:<80W (depending on the number of enabled ports and load)

Working temperature: -5°C to+55°C

2.Customer side interface and business characteristics

Interface configuration: Onboard high-density SFP/SFP+customer side interface.

Supported business types:

Ethernet: 10GE, GE.

TDM: STM-16, STM-4.

OTN: OTU1, OTU2.

Enhance processing capability:

High capacity L2 switching: supports large-scale MAC address tables, VLAN isolation, traffic management, etc.

Large capacity OTN crossover: Provides a larger capacity ODU0/1/2 crossover matrix to meet high-density business scheduling requirements.

3.Line side transmission performance

Line speed: 10G

Line side wavelength: Supports tunable or fixed wavelengths.

Transmission distance: meets the typical transmission requirements for urban access and aggregation.

4.Management and Operations

Cluster port management: Supports grouping, batch operations, and performance comparison analysis of high-density ports in network management.

Intelligent resource monitoring: Real time monitoring of key resource indicators such as onboard switching capacity and port utilization to prevent congestion.

4.Typical application scenarios

Large scale park/enterprise headquarters core computer room: As the business aggregation core of the entire park, it connects a large number of uplink links from various buildings and data centers, and after unified exchange and management, it is connected to the metropolitan area network through 10G wavelength.

Mega POP (Metropolitan Multi Service Access Point): Located in the operator's large integrated access room, it provides high-density access services to numerous enterprise customers, base stations, and residential areas, achieving resource concentration and efficient utilization.

Multi operator shared data center access layer: In the data center where communication infrastructure is shared, high-density and isolated business access ports are provided for different operators to achieve intensive operation of infrastructure.

Modernization of existing high-density access nodes: replacing multiple low-density old devices, reducing rack occupation, improving processing capacity and intelligence level.

5.Summary of Core Values

Ultimate optimization of space and cost: With the highest density of single board solutions, the cabinet space requirements and total number of devices in high-density access scenarios are significantly reduced, optimizing the total cost of ownership (TCO).

Significant improvement in processing capability: Powerful onboard switching and aggregation capabilities enable edge nodes to handle more complex business flows and scheduling strategies.

The complexity of operation and maintenance has been significantly reduced: a unified management interface and intelligent tools make managing dozens of access ports as easy as managing a single logical entity.

Investing for future expansion: High density design reserves sufficient access capacity for future business growth, protecting long-term investments.

6.Ordering and Deployment Instructions

Basic board model: TNV1E212.

Please specify the required port configuration and optical module type when placing an order.

Before deployment, detailed port planning, VLAN planning, traffic engineering, and cross connection design must be carried out to fully leverage its high-density and high-performance advantages.

It is recommended to conduct professional preliminary scheme design and deployment optimization services to ensure the best application effect.