The Perfect Combination of Performance and Density for OSN9800 TNU3U401 Compact 800G Flagship Board

Yantai Boxin International Trading Co., Ltd. is a professional comprehensive trading service provider for communication equipment.With warehouses established in Yantai and Hong Kong, we have built a complete and localized network for delivering communication products and services.In 2018, Yantai Boxin International Trading Co., Ltd. set up its international sales department in Yantai, China.Based in China, we operate in emerging markets across Southeast Asia, India, the Middle East, Africa, Europe, and the United States. 

Yantai Boxin International Trading Co., Ltd. supplies products to various telecom operators, meeting their needs for supplementing and expanding 2G/3G/4G/5G network stations.Our current equipment portfolio covers brands such as Nokia, Ericsson, Alcatel, Huawei, ZTE, ZTT, and FiberHome. 

We expand our international market share by offering high-quality products, excellent service, competitive pricing, and timely delivery.Feel free to contact us for more information.

???????? ????????

1.Product Overview

TNU3U401 is a high-performance compact 800G wavelength division multiplexing circuit board representing top engineering design on the OSN 9800 series optical transmission platform.This board challenges and breaks the traditional balance between high-density integration and extreme performance, integrating industry-leading 800G coherent transmission system within standard board size.It is designed specifically for ultra large scale data center interconnect (DCI) cores, high-end computing power cluster backbones, and high-density metropolitan core nodes that have extremely valuable space resources and strict requirements for single slot transmission capacity.It aims to deliver the maximum absolute transmission bandwidth with minimal physical space occupation and is a core density component for building future EB level data exchange networks.

2.Core Features and Engineering Breakthroughs

Ultimate space efficiency and performance density

By adopting revolutionary high-density optoelectronic collaborative design, advanced packaging, and efficient heat dissipation technology, all complex functional units required for high-performance 800G coherent transmission have been fully realized in a compact board space.

Its"performance/volume ratio" and"capacity/slot ratio" have reached industry-leading levels, enabling a leap in the total capacity of single cabinet systems and maximizing the spatial value of data centers and core data centers.

Top tier 800G transmission performance

Equipped with Huawei's latest generation of high-efficiency oDSP chips, it supports programmable high-order modulation formats (such as 64QAM/128QAM) and enhanced probability shaping technology.

Even in a compact design, it still maintains excellent transmission performance, supporting transmission distances from metropolitan DCI to regional backbone (supporting ≥400km in typical scenarios), meeting the stringent requirements of high-density core scenarios.

Optimization Design for High Density Interconnection

Optimize the traffic model for the internal and interconnected data centers and computing power centers, supporting ultra-low latency transmission and fast link establishment.

Fully supports FlexE (Flexible Ethernet) hard slicing, providing deterministic isolated sub channels for different businesses or tenants within a single physical channel.

Intelligent high-density operation and maintenance

Integrated high-precision environmental and performance sensors, supporting AI based board level health prediction and dynamic thermal management.

Deeply integrated with cloud based network management, supporting batch management and intelligent policy issuance for large-scale and high-density deployment of boards, reducing operational complexity.

3.Detailed technical specifications

1.Physical and General Specifications

Model: TNU3U401

Applicable platform: OSN 9800 U64 and above high-performance high-density subrack

Board type: High performance compact 800G coherent line interface board

Typical power consumption:<200W (in high-efficiency modulation mode, reflecting high-efficiency design)

Working temperature: 5°C to 45°C (optimized for high-density computer room environments)

Core achievement: Achieving 800G full function integration within standard size.

2.Line side transmission performance

Line speed: 800G (can be software downgraded)

Modulation format: Software definable, supporting 64QAM, 16QAM, QPSK, etc., with adaptive tuning capability.

Line side optical interface: Supports high-density pluggable coherent optical modules such as CFP2-DCO.

Working band: C-band (standard), can support system extension to C+L band.

Target application distance:

800G (high-order modulation): mainly aimed at high-performance DCI and metropolitan core scenarios from 80km to 400km.

800G (robust modulation): can be extended to interconnect areas over longer distances.

3.Customer side and business characteristics

Customer side connection: Interconnected with the business board through an ultra-high bandwidth backplane.

Support customer side protocols: 800GE, 400GE, FlexE, OTUCn.

Key optimization: Optimize latency and throughput for high-frequency and high traffic data exchange modes.

4.Management and Operations

Cluster based intelligent management: Under the control of Huawei iMaster NCE, it supports cluster based performance monitoring, energy efficiency analysis, and unified policy configuration for compact 800G boards deployed on a large scale.

Predictive maintenance: Combined with digital twin technology, the health status of high-density boards can be predicted to prevent problems before they occur.

4.Typical application scenarios

Core interconnection of large-scale data center clusters: in the core DCI plane of top cloud service providers or Internet companies, it is used to connect the most important data center hubs to cope with the continuous ultra-high bandwidth pressure caused by AI training and data lake synchronization.

Internal interconnection of national/regional computing power hubs: Within large computing power centers, thousands of computing and storage nodes are connected to build a non blocking 'computing bus'.

High density metropolitan core switching node: In the core data center of a mega city, it is used for ultra high density interconnection between core routers to cope with the convergence impact of 5G, computing power, and high-definition video traffic.

High end financial trading and research network: meeting the extreme requirements for ultra-high bandwidth and low latency in special scenarios such as high-frequency trading, synchrotron radiation sources, astronomical observations, etc.

5.Summary of Core Values

Redefine density standards: Compressing 800G performance to a compact size, setting a new benchmark for space efficiency for network cores.

Unleash the core value of the data center: achieve capacity doubling within limited cabinet space, directly improving the return on investment of infrastructure.

Performance without compromise: While pursuing high density, it ensures top-notch transmission performance, energy efficiency, and reliability.

Facing the EB level future: It is the core cornerstone for building future high-density networks capable of carrying EB level data streams.

6.Ordering and Deployment Instructions

Basic board model: TNU3U401.

To maximize its high-density value, it is recommended to plan and deploy it in newly built or upgraded high-density cabinets and subracks.

It is necessary to ensure that the power supply and cooling capacity of the computer room meet the requirements of high-density equipment clusters.

Provide comprehensive high-end professional services from high-density planning, heat dissipation assessment to deployment optimization.